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  Other Testing Service
IC Testing Items
Visual Inspection
Chemical decapsulation
X-ray Inspection
Permanency Test
Datasheet Comparison
Analysis report
Pb-free/RoHS testing
Solderability Analysis
Reliability Test
AIV
DCCT
KFT
Programming
Failure Analysis
Failure Analysis Experiments
Reliabilities Experiment
Physical Chemical Experiment
Other Auxiliary test services
Home > Other Testing Service > IC Testing Items
IC Testing Items
 
 
Testing item
Visual Inspection
Purpose:
Device marking, body integrity, pins oxidation inspection etc.
Method:
Observation under high-multiple magnifying rate electron microscopy.
Standards:
Inspection Standard:JEDEC &CECC
Applicable situation
Refurbishes, counterfeit checking & fighting, chip’s appearance conformity.
Advantages: Short leadtime, impressive & cost effective.
Deficiency: testing procedures &results are subjective,which may result in misjudgement.
 
 
Testing Item:
Chemical decapsulation
 
Purposes:
To inspect die layout markings, logos, bonding wires etc.
 
Method:
Destructive experiment, remove the packaging epoxy through chemical corrosion to take out the die inside.
 
Standards
Inspection Standard:JEDEC &CECC
Applicable Situation:
Authenticity Inspection auxiliary experiment/N, original MFG logo checking, die layout destructive engineering.
Advantages: Short lead-time, simple, direct & impressive for analyzing MFG’s info.
Deficiencies: not applicable to passive devices,mosfet etc.
 
 
Testing Items:
X-ray Inspection
Purposes:
To inspect device’s packaging situation such as die layout bubbles, bonding wire abnormality,die size, directions etc without damaging chips’ packaging material.
Methods:
Utilize the X-ray for multiple perspectives & angles examination.
Standards:
Inspection Standard:JEDEC &CECC
Applicable Situations:
For bonding abnormality, packaging defects finding, die size & layout conformity.
Advantages: Short Leadtime, simple, impressive for analysis.
Deficiencies: mainly for failure analysis, information amount gathered is rather small.
 
 
Testing Item:
Permanency Test/Acetone Swabing.
Purposes:
To inspect the device markings.
Method:
Acetone swabing for removing the marking of refurbishes.
Standards:
Inspection Standard:JEDEC &CECC
 
Applicable Situations
For remarked parts, refurbishes, counterfeits checking.
Advantage: remarked inferior printing markings can be easily removed.
Deficiencies: Invalid to laser-engraved markings.
 
 
Testing items:
 Datasheet comparison
Purposes:
Devices Pin consistency checking & comparison with datasheet.
Method
Pin PN Junction characteristics checking.
Standards
Inspection Standard:JEDEC &CECC
 
Applicable Situations:
Replacement parts, counterfeits checking.
Advantage: short Leadtime
Deficiency: Rich experiences, techniques as well as expertise are required. Not univeral & applicable to all chips.
 
 
Testing Items:
Analysis report
Purpose
To draw a conclusion based on certain experiment phenomenon.
Method:
Issue report based on the actual happens.
Standards
Inspection Standard:JEDEC &CECC
Applicable Situations:
Summary of experiment result, analysis, testing certifications & conclusion confirmation.
 
 
Testing Items:
Pb-free/RoHS testing.
Purposes:
RoHS Directives Compliance.
Method:
Adopt Metrohm Inline sample processing(MISP),
Standards:
RoHS(2002/95/EC)
Applicable Situation:
RoHS Directives compliance checking.
 
 
Testing Item:
 Solderability Analysis
Purposes:
To detect the pins solderability to the PCB.
Method:
Solder slot balance method, Wetting balance method
Standards
 
Applicable Situation:
Failure analysis/detection caused by devices’ poor solderability.
 
 
Testing Items
Reliability Test(High-low temperature testing, thermal shock testing)
Purposes:
 To check devices withstanding capability in special application environment such as High temperature, Low temperature, fast changing temperature, high humidity environment etc.
Method
Devices defects detection while working-status at constant temperature or changing temperature. Devices defects detection at non working status for constant temperature or changing temperature. 
Standards
 
Original datasheet
Applicable situations:
 
Devices for Military Grade, 883, Industrial Level, avionics, and devices used in special environment.
 
 
Testing Items:
Authenticity Inspection & Verification (AIV)
Purposes
For detection whether devices are original, new& unused.
Method:
Visual Inspection+DECAP+Datasheet comparison +Analysis report
Standards
Original datasheet.
Applicable Situations:
For detection of refurbishes, counterfeits, fakes, new & bulk parts etc, which helps the coordination of trading disputes.
 
 
Testing Items
Electrical Testing/ Direct Current Characteristics Test (DCCT)
Purposes
To test electrical parameters at devices’ non-working status. Which covers fast open/short test, Idd test, DC Leakage test etc.
Method
Electrical test of each pin& parameters analysis
Standards
 
Original datasheet
Applicable Situation:
For open/short, Idd, DC leakage screening before putting on board for mass production.
Advantage: Short leadtime. Result reliable.
 
 
Testing Items:
Programming
Purposes:
Erase/Write programming
Method
Programer
Standard:
Original datasheet
Applicable situations
EPROM,EEPROM,FLASH,MCU
  
 
Testing Items
Functional Test
Purpose
To test & verify devices’ function based on datasheet.
Method
To simulate the device running conditions at the end-user side based on the datasheet, the testing engineer will have to purchase sockets, design specified testing circuit to the testers, make PCB boards, debug & program etc.
Standards
Original datasheet
Applicable Situations
Parts screening, Failure analysis, Incoming quality controls (IQC), for further confirmation of device function based on datasheet.
Advantages: Result relatively more reliable & exact.
 
 
Testing Items:
Failure Analysis
Purposes:
Reason analysis for failed parts.
Method
Based on different failure phenomenon
Standard:
Original datasheet
Applicable situations
To confirm the device failed reasons, help the coordination of trading disputes.