Testing item

Visual Inspection

Purpose:

Device marking, body integrity, pins oxidation inspection etc.

Method:

Observation under high-multiple magnifying rate electron microscopy.

Standards:

Inspection Standard：JEDEC &CECC

Applicable situation

Refurbishes, counterfeit checking & fighting, chip’s appearance conformity.

Advantages: Short leadtime, impressive & cost effective.

Deficiency: testing procedures &results are subjective，which may result in misjudgement.

Testing Item:

Chemical decapsulation

 

Purposes:

To inspect die layout markings, logos, bonding wires etc.

 

Method:

Destructive experiment, remove the packaging epoxy through chemical corrosion to take out the die inside.

 

Standards

Inspection Standard：JEDEC &CECC

Applicable Situation:

Authenticity Inspection auxiliary experiment/N, original MFG logo checking, die layout destructive engineering.

Advantages: Short lead-time, simple, direct & impressive for analyzing MFG’s info.

Deficiencies: not applicable to passive devices,mosfet etc.

Testing Items:

X-ray Inspection

Purposes:

To inspect device’s packaging situation such as die layout bubbles, bonding wire abnormality,die size, directions etc without damaging chips’ packaging material.

Methods:

Utilize the X-ray for multiple perspectives & angles examination.

Standards:

Inspection Standard：JEDEC &CECC

Applicable Situations:

For bonding abnormality, packaging defects finding, die size & layout conformity.

Advantages: Short Leadtime, simple, impressive for analysis.

Deficiencies: mainly for failure analysis, information amount gathered is rather small.

Testing Item:

Permanency Test/Acetone Swabing.

Purposes:

To inspect the device markings.

Method:

Acetone swabing for removing the marking of refurbishes.

Standards:

Inspection Standard：JEDEC &CECC

 

Applicable Situations

For remarked parts, refurbishes, counterfeits checking.

Advantage: remarked inferior printing markings can be easily removed.

Deficiencies: Invalid to laser-engraved markings.

Testing items:

 Datasheet comparison

Purposes:

Devices Pin consistency checking & comparison with datasheet.

Method

Pin PN Junction characteristics checking.

Standards

Inspection Standard：JEDEC &CECC

 

Applicable Situations:

Replacement parts, counterfeits checking.

Advantage: short Leadtime

Deficiency: Rich experiences, techniques as well as expertise are required. Not univeral & applicable to all chips.

Testing Items:

Analysis report

Purpose

To draw a conclusion based on certain experiment phenomenon.

Method:

Issue report based on the actual happens.

Standards

Inspection Standard：JEDEC &CECC

Applicable Situations:

Summary of experiment result, analysis, testing certifications & conclusion confirmation.

Testing Items:

Pb-free/RoHS testing.

Purposes:

RoHS Directives Compliance.

Method:

Adopt Metrohm Inline sample processing(MISP),

Standards:

RoHS(2002/95/EC)

Applicable Situation:

RoHS Directives compliance checking.

Testing Item:

 Solderability Analysis

Purposes:

To detect the pins solderability to the PCB.

Method:

Standards

 

Applicable Situation:

Failure analysis/detection caused by devices’ poor solderability.

Testing Items

Reliability Test(High-low temperature testing, thermal shock testing)

Purposes:

 To check devices withstanding capability in special application environment such as High temperature, Low temperature, fast changing temperature, high humidity environment etc.

Method

Devices defects detection while working-status at constant temperature or changing temperature. Devices defects detection at non working status for constant temperature or changing temperature. 

Standards

 

Original datasheet

Applicable situations:

 

Devices for Military Grade, 883, Industrial Level, avionics, and devices used in special environment.

Testing Items:

Authenticity Inspection & Verification (AIV)

Purposes

For detection whether devices are original, new& unused.

Method:

Visual Inspection+DECAP+Datasheet comparison +Analysis report

Standards

Original datasheet.

Applicable Situations:

For detection of refurbishes, counterfeits, fakes, new & bulk parts etc, which helps the coordination of trading disputes.

Testing Items

Electrical Testing/ Direct Current Characteristics Test (DCCT)

Purposes

To test electrical parameters at devices’ non-working status. Which covers fast open/short test, Idd test, DC Leakage test etc.

Method

Electrical test of each pin& parameters analysis

Standards

 

Original datasheet

Applicable Situation:

For open/short, Idd, DC leakage screening before putting on board for mass production.

Advantage: Short leadtime. Result reliable.

Testing Items:

Programming

Purposes:

Erase/Write programming

Method

Programer

Standard:

Original datasheet

Applicable situations

EPROM,EEPROM,FLASH,MCU

Testing Items

Functional Test

Purpose

To test & verify devices’ function based on datasheet.

Method

To simulate the device running conditions at the end-user side based on the datasheet, the testing engineer will have to purchase sockets, design specified testing circuit to the testers, make PCB boards, debug & program etc.

Standards

Original datasheet

Applicable Situations

Parts screening, Failure analysis, Incoming quality controls (IQC), for further confirmation of device function based on datasheet.

Advantages: Result relatively more reliable & exact.

Testing Items:

Failure Analysis

Purposes:

Reason analysis for failed parts.

Method

Based on different failure phenomenon

Standard:

Original datasheet

Applicable situations

To confirm the device failed reasons, help the coordination of trading disputes.