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Home >IC Test & Verification> Level I AIV
Level I AIV
Level-I Authenticity Inspection & Verification
General Description
        It is a test method used to verify whether the electronic components conditions are in consistency with the Original Manufacturer through the way of chemical corrosion, physical microscope magnifying observation etc.  

Test Items:

1. Incoming Devices Packaging Inspection:

     (1)Specified materials from Original Manufacturer
     (2)Label & Marking
     (3)Date Code & Lot Number Checking
     (4)ESD Compliance (Charge Additionally)
 
       ESD Standards:MIL-STD-129
      
      (5)MSL Inspection & Checking
        Moisture Sensitive Level (MSL) Checking is a special method applied to assure /indicate whether the devices are preserved under proper protection for avoiding the moisture affection or can be solderred well to PCB boards with reflow tools. 
        Inspection standards:JESD22-A113-D EIAJED- 4701-B101
        Moisture Sensitivity is divided into six levels, the higher the level ranks, the more moisture sensitive it is.
       
      With exposure the devices in the air, the moisture affection degree & time is listed as following:
       
LEVEL
FLOOR LIFE
SOAK REQUIREMENTS
Standard
Accelerated Equivalent1
 
TIME
CONDITIONS
TIME(hours)
CONDITIONS
TIME(hours)
CONDITIONS
1
Unlimited
≤30℃/85% RH
168
+5/-0
85℃/85% RH
 
 
2
1 year
≤30℃/60% RH
168
+5/-0
85℃/60% RH
 
 
2a
4 weeks
≤30℃/60% RH
6962
+5/-0
30℃/60% RH
120
+1/-0
60℃/60% RH
3
168 hours
≤30℃/60% RH
1922
+5/-0
30℃/60% RH
40
+1/-0
60℃/60% RH
4
72 hours
≤30℃/60% RH
962
+2/-0
30℃/60% RH
20
+0.5/-0
60℃/60% RH
5
48 hours
≤30℃/60% RH
722
+2/-0
30℃/60% RH
15
+0.5/-0
60℃/60% RH
5a
24 hours
≤30℃/60% RH
482
+2/-0
30℃/60% RH
10
+0.5/-0
60℃/60% RH
6
Time on Label
(TOL)
≤30℃/60% RH
TOL
30℃/60% RH
 
 
 
 
e.g: The MSL Level of EP20K1500EBC652 is 5A
 
 
Please contact Semiconductor Materials Sales for purchasing Humidity Indicator Card (HIC).
 
2. Physical Measurements & External Visual Inspection
     (1)Pin Integrity
            This item applies to check the integrity of pins, leads, balls for soldering, to confirm whether the devices are in compliance with relevant    soldering  standards.
            Inspection StandardsJESD22-B105C
 
     (2)Coplanarity Inspection
             This item applies to check the coplanarity deviation for SMD & BGA devices (pins, leads & balls).
              
             Inspection Standards:JESD22-B108A
   
     (3)Dimensions Inspection
             This item applies to check whether the device package & external dimensions are in accordance with original datasheet.
             Inspection Standards:JESD22-B100B
      
     4)External Visual Inspection
      This item applies to check whether the device package, design, structures, label & marking are in accordance with the original datasheet. External visual inspection are a universal inspection method applicable to all pakages.
   Inspection Standards:JESD22-B101 & CECC Inspection Standards
     (5)Acetone Swab Process
             This item applies to verify whether the surface marking & logo are original through acetone Swabing. The original markings are usually laser engraved and hard to be removed by acetone, while the burnished & remarked one from inferior inks can be easily removed. 
                               
3. Pin Consistency Checking
         This item applies to choose randomly several pieces of samples from a lot to measure the PN junction voltage & check whether it's in compliance with the original datasheet.
            
4. Random Sampling Inspection(If necessary)
    (1)Solderability Inspection
           This item applies to verify the soldering effects under both Pb free & Pb-contained soldering materials conditions.
            Inspection StandardJESD22-B102D PC/EIA J-STD-002C
           e.g
         
          
      (2)Chemical Decapsulation
               This item is a destructive experiment to the device through chemical corrosion to open the surface package and inspect the die layout markings, logos & structure through multiple electron microscope magnifying observation. This evidence finding method occasionally plays a most key & effective way in the process of identifying counterfeits. 
               The minimum size we can inspect reaches as low as 65 nm.
                Inspect Standard:JESD22-B102D PC/EIA J-STD-002C
           e.g
              
        
 
  (3)X Radiography Fluoroscopy Examination
           This item applies to check the integrity of the internal physical structure & bonding wire, the existence of excessive air bubbles which have immerged into the interlayer between die & packaging materials through x radiography fluoroscopy.
      
        
       
(4)C-SAM (Scanning Acoustic Microscope) Inspection
        This item applies to check the existence or not of internal air bubbles, scrathes & cracks within the devices.
         Inspect StandardJESD22-B102D PC/EIA J-STD-002C
       e.g
      
      
       Deficiency of  Level I AIV
       1.It's very difficult to identify the device's authenticity If die layout marking is different from device surface marking.  AIV can not distinguish the differences of devices with same / similar function but part number with different suffixes (the part number suffixes are mainly used to describe temperature ranges, speed grades, special functions etc).
       2. AIV can not tell the devices' functional status( e.g. Can they run in end-user's application circuits?).  Further test level (Level III, IV) should have to conduct for meeting such requirements.
     
       Sample Test Report:Please refer to the test templates & samples at homepage.